首页>
外国专利>
Bonding pad of semiconductor memory device for improving adhesive strength bonding pad and bonding wire and method of manufacturing the same
Bonding pad of semiconductor memory device for improving adhesive strength bonding pad and bonding wire and method of manufacturing the same
展开▼
机译:用于提高粘合强度的半导体存储器件的键合焊盘和键合线及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A bonding pad of a semiconductor device having a step and a manufacturing method thereof are provided to the adhesion force of a bonding wire and a bonding pad by increasing an adhesion area of the bonding wire and pad. CONSTITUTION: The bonding pad(17) has a contact hole formed by patterning an insulation film(13) at a position to form the bonding pad by using a photoresist etching technology and has a conductive material formed on the contact hole and the insulation film. The step(20) is formed on the surface of the bonding pad. The bonding pad has the contact material between the contact hole and the pad. The step is formed by the contact hole.
展开▼