A facility for dissolution and supply of copper oxide for electrolytic plating of copper

摘要

PURPOSE: An apparatus for dissolving and supplying copper oxide for electrolytic or electroless copper plating is provided which extends the life of a plating solution and removes impurities in the plating solution, thereby obtains high quality plating coating film by supplying copper ions. CONSTITUTION: The apparatus for dissolving and supplying copper oxide for electrolytic or electroless copper plating comprises an automatic copper oxide powder suction and supply unit(10) using integrating electric power(AHr), a copper oxide suction unit(4), copper oxide powder filtering bag type filters(5,6) for filtering copper oxide powder, air agitators(18), two copper oxide dissolution vessels(13,14) for dissolving copper oxide by air agitation, a circulation line(17) connected between the copper oxide dissolution vessels(13,14) to adjust concentration of the copper oxide solution, and a solution filter(15) for filtering impurities, wherein copper oxide powder is supplied and sucked by integral electric power, copper oxide powder passing through the filters(5,6) having a sieve size corresponding to 1 micron is dissolved by a sulfuric acid solution in the air agitators(18) to reduce impurities to the highest degree and supply an electrolyzed copper plating solution which can be applied regardless of shape of a plating bath.