WEAK ACIDIC ELECTROLYTIC SILVER-PLATING PEELING COMPOSITION AND METHOD FOR PEELING SILVER-PLATE USING SAME

摘要

PURPOSE: A weak acid electrolytic composition for peeling plated silver off and selective peeling method of plated silver. CONSTITUTION: The weak acid electrolytic composition for peeling plated silver off comprises 10 to 225 g/L of more than one organic acid selected from methane sulfonic acid, lactic acid, succinic acid, ammonium succinate, DL-malic acid or their mixtures; 10 to 150 g/L of conductive salt selected from dimethylamine, ammonium sulfate, ammonium phosphate, potassium citrate or their mixtures; 2 to 30 g/L of stabilizer selected from thiourea, diethyl thiourea, thioacetamide, ethanolamine, triethylenetetramine, isopropyl alcohol or their mixtures; and 0.05 to 2 g/L of surfactant selected from naphthalene-1-sulfonic acid(alpha)sodium, N,N-diethyl-1,3-diaminopropane, beta-naphthol ethoxylate, polyethyleneglycol oleyl ether or their mixtures. The selective peeling method of plated silver using the weak acid electrolytic composition is characterized in that a silver plated article as positive electrode and a stainless steel plate as a negative electrode are dipped in the weak acid electrolytic composition; impressing electric current in a cathode current density of 1.5 A/dm¬2 at 20 to 35 deg.C for peeling off plated silver; and the weak acid electrolytic composition has a pH range of 5 to 7.