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LED packaging lead frame and LED back light unit

机译:LED封装引线框和LED背光单元

摘要

The present invention relates to a LED packaging lead frame for a backlight unit and a backlight unit of a liquid crystal display device using the lead frame, wherein the lead frame is formed so that the lead pins protrude only on one side of a mold case molded to the substrate portion on which the LED is mounted. As the LED package is formed by using to prevent moisture penetration, the luminous effect can be maximized, and the inclined uneven locking jaw coupled to the mold case and the light guide plate respectively for complementary coupling of the LED package and the light guide plate; It provides a LED backlight unit of a liquid crystal display device that can be formed by the engaging portion so that the combination by the so-called, one-touch type to increase the productivity and reliability of the luminous effect.
机译:LED封装引线框架和使用该封装框架的液晶显示器技术领域本发明涉及用于背光单元的LED封装引线框架和使用该引线框架的液晶显示装置的背光单元,其中引线框架形成为使得引线引脚仅在模制的模制壳体的一侧突出。到安装有LED的基板部分上。由于采用防止水分渗透的方式形成LED封装,可以使发光效果最大化,并且倾斜的凹凸不平的卡爪分别耦接到模具壳体和导光板,以互补地耦合LED封装和导光板。本发明提供一种液晶显示装置的LED背光单元,该LED背光单元可以由接合部形成,从而通过所谓的单触式的组合来提高生产率和发光效果的可靠性。

著录项

  • 公开/公告号KR200271799Y1

    专利类型

  • 公开/公告日2002-04-10

    原文格式PDF

  • 申请/专利权人 (주)대광반도체;

    申请/专利号KR20020002191U

  • 发明设计人 박윤규;

    申请日2002-01-23

  • 分类号G02F1/13357;

  • 国家 KR

  • 入库时间 2022-08-22 00:28:49

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