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Method for separating semiconductor chips from wafer, involves initially scribing separation lines on wafer by laser beam
Method for separating semiconductor chips from wafer, involves initially scribing separation lines on wafer by laser beam
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机译:从晶片分离半导体芯片的方法,包括首先通过激光束在晶片上划刻分离线
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摘要
A method for separating semiconductor chips from a wafer, involves scribing in a first step along given separation lines on the wafer by laser beam, and in a second step the wafer is divided into semiconductor chips in an ultra-sound bath.
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