首页> 外国专利> Method used for producing a source or drain region of a transistor in a semiconductor substrate comprises growing the source or drain region doped in situ with selective epitaxy

Method used for producing a source or drain region of a transistor in a semiconductor substrate comprises growing the source or drain region doped in situ with selective epitaxy

机译:用于在半导体衬底中产生晶体管的源极或漏极区的方法包括:生长具有选择性外延的原位掺杂的源极或漏极区。

摘要

Method used for producing a source or drain region (17) of a transistor (32) in a semiconductor substrate (1) comprises growing the source or drain region doped in situ with selective epitaxy. Preferred Features: A mask layer (16) is arranged on a surface of the substrate. Part of the mask layer is removed, and a mask window (19) reveals a first region of the substrate surface. The selective epitaxy grows on the first region of the substrate surface and does not grow on a second region of the substrate surface covered by the mask layer. A doped profile having different concentrations of doping medium is produced on formation of the source or drain region.
机译:用于在半导体衬底(1)中产生晶体管(32)的源极或漏极区(17)的方法包括:生长具有选择性外延的原位掺杂的源极或漏极区。优选特征:掩模层(16)布置在衬底的表面上。去除部分掩模层,并且掩模窗口(19)露出衬底表面的第一区域。选择性外延生长在衬底表面的第一区域上,而不生长在被掩模层覆盖的衬底表面的第二区域上。在形成源区或漏区时产生具有不同掺杂介质浓度的掺杂轮廓。

著录项

  • 公开/公告号DE10037248A1

    专利类型

  • 公开/公告日2002-02-21

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2000137248

  • 发明设计人 WOLF KONRAD;MUELLER KARLHEINZ;

    申请日2000-07-31

  • 分类号H01L21/336;H01L21/8238;

  • 国家 DE

  • 入库时间 2022-08-22 00:27:35

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