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Test cells structure for estimating the electrical properties of on a substrate surfaces, which are formed closely spaced
Test cells structure for estimating the electrical properties of on a substrate surfaces, which are formed closely spaced
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机译:测试单元结构,用于估计紧密间隔形成的基板表面上的电性能
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摘要
It is a test cells structure provided with a precise measurement of electrical properties, for example in the electrical resistance, and between adjacent solder bumps in a function of a decreasing distance between the solder bumps permits. Dollars a the test cells structure comprises a substrate having at least a partial insulating surface, central and peripheral beads, which on the partly insulating surface are provided, and an insulating layer, which is provided between the beads of. At least two corresponding distances between the central solder bumps and the concomitant peripheral beads are different, so that a variation of the electrical resistance with respect to the change in the distance between adjacent beads can be determined. In particular, if the distances than 80 mu m and less are selected, it is possible for the measurements obtained with corresponding design rules for semiconductor components in relation to setting. Furthermore, a test cells receiving structure, preferably with the embodiment of a test cells receiving structure, so that the electrical properties of both for the test cells structure alone and also for a combined element, in which a test cells structure with the test cells structure by means of flip - chip - art is connected, can be obtained. Furthermore, a method for determining the characteristics of adjacent solder bumps discloses.
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