Chip card has a chip carrier or support with additional slits in its surface to prevent transferal of longitudinal bending forces from the card to the chip

摘要

Contact surfaces (C1-C7) are provided on opposite sides of the chip space (6) for attachment of the chip carrier (1) to a chip card. Slits (8) are provided in the longitudinal direction (11) of the chip carrier to separate contact surfaces (4) for connection wires for the semiconductor chip from the contact surfaces (C1-C7). Bending of the chip card in the longitudinal direction is largely prevented from causing bending tension in the chip module due to the slits.