首页> 外国专利> Chip card module and device for preventing bending of the chip module, which is based on a stiffening frame that is designed to bend in fixed positions, thus protecting the chip, when a bending force limit is exceeded

Chip card module and device for preventing bending of the chip module, which is based on a stiffening frame that is designed to bend in fixed positions, thus protecting the chip, when a bending force limit is exceeded

机译:芯片卡模块和用于防止芯片模块弯曲的装置,该模块基于加固框架,该加固框架设计为在固定位置弯曲,从而在超过弯曲力极限时保护芯片

摘要

Chip card module has a support and a chip comprising an integrated circuit that is mounted on the support using a stiffening frame (14) arranged around the chip. The stiffening frame has at least two design bending points (15) that are arranged along design bending lines (7, 8), along which the stiffening frame bends when a bending force is applied to the card support that exceeds a preset value.
机译:芯片卡模块具有支架和包括集成电路的芯片,该集成电路使用布置在芯片周围的加强框架(14)安装在支架上。加强框架具有沿着设计弯曲线(7、8)布置的至少两个设计弯曲点(15),当向卡支架施加的弯曲力超过预设值时,加强框架沿着该弯曲点弯曲。

著录项

  • 公开/公告号DE10143108A1

    专利类型

  • 公开/公告日2003-04-03

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2001143108

  • 发明设计人 SCHINDLER WOLFGANG;GUNDLACH HARALD;

    申请日2001-09-03

  • 分类号G06K19/077;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:41

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