Material for ball-grid arrays comprises a plating layer formed from two metals which are mixed together on a metal material as the base material and a covering layer formed from the metal on the plating layer

摘要

Material comprises a plating layer (A) formed from a metal (X) and metal (Y) which are mixed together on a metal material as the base material and a covering layer (B) formed from the metal (X) on the plating layer. An Independent claim is also included for a process for electrically connecting a material of an electronic component. Preferred Features: The metal (X) is tin and the metal (Y) is silver, copper, zinc, bismuth or indium. The covering layer (B) is formed from tin on the plating layer.