Contact electrode formation for semiconductor device manufacture, involves transferring substrate to plasma pretreatment module and deposition module, to remove bottom layer of contact hole and fill with depositing material

摘要

A semiconductor substrate with a contact hole is loaded into a transfer apparatus containing a plasma pretreatment module and a deposition module connected together. The substrate is transferred to the plasma pretreatment module, for ashing photoresist pattern and removing bottom layer of the contact hole. The substrate is cleaned and transferred to vacuum deposition module for filling with a depositing material.