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Semiconducting arrangement has source, base, drift, drain regions, gate isolation layer and gate electrode; channel region with lateral flow is formed when voltage applied to gate electrode
Semiconducting arrangement has source, base, drift, drain regions, gate isolation layer and gate electrode; channel region with lateral flow is formed when voltage applied to gate electrode
The semiconducting arrangement has a substrate with source and base regions extending vertically from the upper surface. The base region is in contact with the source region. A drift region extends vertically from the upper surface and is in contact with a second base region surface. There are a drain region, a gate isolation layer and a gate electrode. When a voltage is applied to the gate electrode a channel region with lateral flow is formed. The arrangement has a semiconducting substrate with a first conductivity type source region (1) and a second conductivity type base region (3) both extending vertically from the upper surface. The first surface of a base region is in contact with the source region. A first conductivity type drift region (4) has a lower disturbance point concentration than the source region, extends vertically from the upper surface and is in contact with the second base region surface. There are a drain region (5), a gate isolation layer (7) and a gate electrode (8). When a voltage is applied to the gate electrode a channel region with lateral flow is formed. AN Independent claim is also included for the following: a method of manufacturing a semiconducting arrangement.
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