Bump bonder and tip/chip conveying manner null for bump bonder

摘要

PROBLEM TO BE SOLVED: To perform the replacement of an IC chip instantaneously to shorten the work interruption time, in finising the work on a bonding stage, by providing an IC carriage unit with a plurality of retaining jigs. ;SOLUTION: The specified IC chip within the tray 2 set in a parts supply position P waits for the bonding work to be completed in the position of a bonding stage 7, being sucked by the first suction nozzle 13a of an IC carriage unit 9, with a suction head 12 staying in the position of a bonding stage 7. When the bonding work is completed, the second suction nozzle 13b sucks the IC chip a where a bump is made. Next, the first suction nozzle 13a places the IC chip that it is sucking itself onto the bonding stage 7. Then, the suction head 12 returns to the parts supply position 13 and accommodates the IC chip sucked by the second suction nozzle 13b in the specified vacant space of the tray 2. By repeating such operation, the bonding work is put forward practically without waiting time, and production efficiency can be improved.;COPYRIGHT: (C)1997,JPO