The electric device and electric device production manner null in order to offer the conservation section for EOS transient phenomenon

摘要

PROBLEM TO BE SOLVED: To secure a space on a printed circuit board by filling a voltage variable material between electrical leads and a ground plane, and physically connecting the electrical leads and the ground plane to thereby incorporate a portion to be protected from electrical overstress transients into an existing electrical device structure. ;SOLUTION: A voltage variable material 10 is applied to a lead frame 50 comprised of a plurality of electrical leads 60, 60', 61, 61', 62, 62', 63, 63', 64, 64', and a ground plane 70. The electrical leads are spaced from one another at a predetermined distance A. The plane 70 is adjacently spaced from the corresponding leads 60, 60' and the like at a predetermined distance B. A layer made of the material 10 fills a space between the leads 60, 60' and the like as well as a space between the leads 60, 60' and the like and the plane 70. The layer made of the material 10 physically connects the electrical leads to the plane 70.;COPYRIGHT: (C)2000,JPO