首页> 外国专利> DEVICE FOR CONTROLLING FILM FORMATION, FILM-FORMING APPARATUS, FILM-FORMING METHOD, METHOD FOR CALCULATING FILM THICKNESS FLOW FACTOR, AND PROGRAM

DEVICE FOR CONTROLLING FILM FORMATION, FILM-FORMING APPARATUS, FILM-FORMING METHOD, METHOD FOR CALCULATING FILM THICKNESS FLOW FACTOR, AND PROGRAM

机译:用于控制膜形成的装置,膜形成装置,膜形成方法,膜厚度流动因子的计算方法以及程序

摘要

PROBLEM TO BE SOLVED: To provide a film-forming apparatus which can easily optimize a gas supply amount, and a device for controlling film formation.;SOLUTION: This film-forming method comprises estimating a relationship between the flow rate of the reaction gas supplied from several pipes and a growth rate of the film on a substrate, and controlling the flow rate of the reaction gas supplied from the several pipes, to form the film. By estimating the relationship between the flow rate and film thickness, the film thickness can be easily approached to a target value. The relationship can be estimated by using, for example, a linear approximation model which linearly approximates the relationship between the flow rate of the gas and the growth rate of the film on the above substrate.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种可以容易地优化气体供应量的成膜装置和用于控制成膜的装置。解决方案:该成膜方法包括估计所供应的反应气体的流量之间的关系。通过从多个管中得到的气体和膜在基板上的生长速率,并控制从多个管中提供的反应气体的流速来形成膜。通过估计流量与膜厚之间的关系,可以容易地使膜厚接近目标值。该关系可以通过使用例如线性近似模型来估计,该线性近似模型线性地近似气体的流速与上述基板上的膜的生长速率之间的关系。COPYRIGHT:(C)2003,JPO

著录项

  • 公开/公告号JP2003166066A

    专利类型

  • 公开/公告日2003-06-13

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20010367790

  • 发明设计人 OBARA ASAKI;SAKAMOTO KOICHI;

    申请日2001-11-30

  • 分类号C23C16/52;H01L21/02;H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:55

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