SOLUTION APPLYING DEVICE, SOLUTION APPLYING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To uniformly apply a solution on a substrate on which a resist is formed, and circulate the solution nicely in a solution applying method quick in the moving speed of the solution, or the circulation of the solution with respect to the substrate such as spin coating.;SOLUTION: A mask of the resist formed on the substrate is irradiated by ultraviolet rays 200. Or, ozone water is contacted with the same immediately before dripping or flowing of the solution onto the substrate, whereby the angle of contact of the resist with respect to the solution is reduced to uniformly apply the solution on the substrate.;COPYRIGHT: (C)2003,JPO