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Method of controlling chemical solution applying apparatus, chemical solution applying apparatus, and method of manufacturing semiconductor device
Method of controlling chemical solution applying apparatus, chemical solution applying apparatus, and method of manufacturing semiconductor device
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机译:控制化学溶液施加装置的方法,化学溶液施加装置以及制造半导体器件的方法
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摘要
A method for controlling a chemical solution applying apparatus is disclosed. The method includes setting at least two dummy dispense rates for dummy dispensation which is periodically carried out by the chemical solution applying apparatus, and switching the dummy dispense rates so that the amount of chemical solution dispensed during a first predetermined period is kept over a predetermined value.
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