Lead/read position inspection manner and survey instrument

摘要

PURPOSE:To provide a method and a device for a lead position which can inspect whether the lead tip of a semiconductor IC package is positioned at a fixed position with required precision or not. CONSTITUTION:A lead position inspecting device is provided with a transfer robot 60, a measuring base 72 where a coordinate system is set, an image pickup device 80 picking up the image of a semiconductor IC package 2 mounted on a measuring surface, and a picture processing unit 90 processing the output picture from the image pickup device 80. The picture processing unit 90 expresses the positions of lead tips by the coordinates based on the output picture of the semiconductor IC package 2, while the coordinates of the lead tips of a standard semiconductor IC package are computed as standard coordinates on the same coordinate system. The detected coordinates of the respective lead tips of the semiconductor IC package 2 and the computed standard coordinates of the corresponding respective lead tips of the standard semiconductor IC package are compared with each other.