Crystallized glass constituent for circuit substrate, crystallized glass sintering body, insulator constituent, insulator paste and thick film circuit substrate

摘要

PROBLEM TO BE SOLVED: To obtain a crystallized glass composition for circuit board, sinterable at a temp. of =1,100 deg.C, capable of providing characteristics such as =12 relative dielectric constant and =12 ppm/ deg.C coefficient of thermal expansion suitable as an electrical insulating material for a circuit board. SOLUTION: This glass composition comprises SiO2, MgO and CaO, has a composition ratio (SiO2, MgO, CaO) by wt.% in a range in a triangular diagram of the figure enclosed by point A (25, 45, 30), point B (25, 0, 75), point C (44, 0, 56), point D (44, 22, 34), point E (40, 19, 41) and point F (29, 40, 31) and is made to precipitate at least one crystal phase of merwinite, monticellite and calcium silicate by heat treatment. Ceramic powder having =6.0 ppm/ deg.C coefficient of thermal expansion is sometimes added to powder composed of the glass composition.