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UNSATURATED POLYESTER RESIN MOLDING MATERIAL AND FIBER- REINFORCED PLASTIC MOLDED ARTICLE

机译:非饱和聚酯树脂模塑材料和纤维增强塑料模塑制品

摘要

PROBLEM TO BE SOLVED: To provide an unsaturated polyester resin molding material permitting the manufacture of a polishing jig which has a long useful time, gives a polished product of high polishing accuracy, exhibits excellent polishing efficiency and is inexpensive.;SOLUTION: The unsaturated polyester resin molding material comprises as essential ingredients an unsaturated polyester resin (A) having a number- average molecular weight of 1,000-30,000 obtained by reacting a polybasic acid component comprising as essential ingredients an α,β-unsaturated polybasic acid or an anhydride thereof with a polyhydric alcohol, a modified unsaturated epoxy ester resin (B) obtained by reacting an epoxy compound bearing at least one epoxy group in the molecule with an α,β-unsaturated monobasic acid to give an unsaturated epoxy ester resin and reacting thus obtained unsaturated epoxy ester resin with an unsaturated acid anhydride in an amount corresponding to 1-20 mole% based on the hydroxy groups in the unsaturated epoxy ester resin, an unsaturated monomer (C) and fibers (D), where the content of the fibers is 10-75 wt.%.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种不饱和聚酯树脂成型材料,其允许制造具有较长使用时间的抛光夹具,提供具有高抛光精度的抛光产品,表现出优异的抛光效率并且廉价。树脂模塑材料包含作为主要成分的不饱和聚酯树脂(A),其通过使包含α,β-不饱和多元酸或其酸酐作为基本成分的多元酸组分反应而获得的数均分子量为1,000-30,000用多元醇,使分子中带有至少一个环氧基的环氧化合物与α,β-不饱和一元酸反应得到不饱和环氧酯树脂并使其反应而得到的改性不饱和环氧酯树脂(B)。得到的不饱和环氧酯树脂与不饱和酸酐的量对应于1-20摩尔%关于不饱和环氧酯树脂中的羟基,不饱和单体(C)和纤维(D),其中纤维含量为10-75 wt。%;版权:(C)2003,JPO

著录项

  • 公开/公告号JP2003238640A

    专利类型

  • 公开/公告日2003-08-27

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP20020035964

  • 发明设计人 SATO MASAHIRO;OBATA YASUHIRO;

    申请日2002-02-13

  • 分类号C08F299/04;C08J5/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:18:19

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