首页> 外国专利> PHASE SEPARATION-TYPE RESIN COMPOSITION, PHASE SEPARATION-TYPE RESIN FILM, AND METHOD FOR MANUFACTURING CIRCUIT BOARD COATED WITH PHASE SEPARATION-TYPE RESIN COMPOSITION

PHASE SEPARATION-TYPE RESIN COMPOSITION, PHASE SEPARATION-TYPE RESIN FILM, AND METHOD FOR MANUFACTURING CIRCUIT BOARD COATED WITH PHASE SEPARATION-TYPE RESIN COMPOSITION

机译:相分离型树脂组合物,相分离型树脂膜以及用相分离型树脂组合物涂覆的电路板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a phase separation-type resin composition and a phase separation-type film which are clearly phase separated as a result of the emulsification of an electrically conductive material and an insulating material.;SOLUTION: The phase separation-type resin composition comprises an emulsion obtained by dissolving an electrically conductive resin in a solvent A, dissolving an insulating resin in a solvent B which is noncompatible with the solvent A, and mixing and emulsifying them.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种相分离型树脂组合物和相分离型膜,其由于导电材料和绝缘材料的乳化而明显地相分离;解决方案:相分离型该树脂组合物包括通过将导电树脂溶解在溶剂A中,将绝缘树脂溶解在与溶剂A不相容的溶剂B中并将其混合和乳化而获得的乳液。COPYRIGHT:(C)2003,JPO

著录项

  • 公开/公告号JP2003238830A

    专利类型

  • 公开/公告日2003-08-27

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP20020041957

  • 发明设计人 INADA TEIICHI;

    申请日2002-02-19

  • 分类号C08L101/12;C08K3/08;H01L23/14;H05K3/32;

  • 国家 JP

  • 入库时间 2022-08-22 00:18:16

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