首页> 外国专利> CUTTING DEVICE AND METHOD FOR WIDE STRIP PHOTOSENSITIVE MATERIAL AND CONTROL METHOD OF CIRCUMFERENTIAL SPEED RATIO OF UPPER EDGE TO LOWER EDGE

CUTTING DEVICE AND METHOD FOR WIDE STRIP PHOTOSENSITIVE MATERIAL AND CONTROL METHOD OF CIRCUMFERENTIAL SPEED RATIO OF UPPER EDGE TO LOWER EDGE

机译:宽条形感光材料的切割装置和方法以及上缘至下缘的圆周速度比的控制方法

摘要

PROBLEM TO BE SOLVED: To provide a cutting device and method suppressing the peeling of a photosensitive layer on a cutting surface in the whole range from a low feed speed range to a high feed speed range, when the wide-width strip photosensitive material is cut into narrow-width ones by a shear cutting method.;SOLUTION: This cutting device is provided with multiple sets of rotating edges comprising sets of upper edges and lower edges rotating in the mutually inverse direction and cuts the running wide-width strip photosensitive material into multiple narrow-width belt-shaped photosensitive materials along the running direction. This cutting device for the wide-width strip photosensitive material is characterized in cutting the photosensitive material by changing the circumferential speed ratio of the rotating edges according to the feed speed of the wide- width strip photosensitive material.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种切割装置和方法,其在切割宽条带状感光材料时在从低进给速度范围到高进给速度范围的整个范围内抑制切割表面上感光层的剥离。解决方案:该切割装置配有多组旋转边,包括沿相反方向旋转的上边缘和下边缘,并将行进的宽条形感光材料切割成沿行进方向的多种窄带状感光材料。该宽幅条状感光材料的切割装置的特征在于,通过根据宽幅条状感光材料的进给速度改变旋转边缘的圆周速度比来切割感光材料。COPYRIGHT:(C)2003,日本特许厅

著录项

  • 公开/公告号JP2003011086A

    专利类型

  • 公开/公告日2003-01-15

    原文格式PDF

  • 申请/专利权人 KONICA CORP;

    申请/专利号JP20010194444

  • 申请日2001-06-27

  • 分类号B26D1/24;G03C1/00;

  • 国家 JP

  • 入库时间 2022-08-22 00:17:30

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