首页> 外国专利> PATTERN ELIMINATING METHOD FOR RECYCLE OF MASKED SUBSTRATE, AND PATTERN ELIMINATING DEVICE, AND MASKING- PATTERN-ELIMINATED SUBSTRATE

PATTERN ELIMINATING METHOD FOR RECYCLE OF MASKED SUBSTRATE, AND PATTERN ELIMINATING DEVICE, AND MASKING- PATTERN-ELIMINATED SUBSTRATE

机译:回收被掩盖基质的图案消除方法,图案消除装置以及掩盖图案消除基质

摘要

PROBLEM TO BE SOLVED: To provide a pattern eliminating method for recycle of a masked substrate formed with the predetermined pattern on the substrate and already used by eliminating the pattern to recycle as a substrate to be masked, and to provide a pattern eliminating device, and to easily manufacture a low-priced substrate of high quality to be masked without exerting an influence on the surrounding environment.;SOLUTION: The pressure for injecting the blast material 16 to the pattern 23 of the masked substrate 21 is adjusted to 2.0 kg/cm2, and the blast material 16 is injected to the corresponding pattern by a nozzle 13 at the corresponding pressure to eliminate the pattern.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种用于消除在基板上形成有预定图案并且已经被使用的掩膜基板的图案消除方法,该掩膜基板通过消除图案而被回收以用作要掩膜的基板,并且提供一种图案消除装置,以及以便容易地制造出高质量的低价被掩膜基板,而又不影响周围环境。解决方案:将喷砂材料16注入到被掩膜基板21的图案23的压力调整为2.0 kg / cm 2 ,并通过喷嘴13在相应的压力下将喷砂材料16注入到相应的图案中,以消除该图案。;版权:(C)2003,JPO

著录项

  • 公开/公告号JP2003145426A

    专利类型

  • 公开/公告日2003-05-20

    原文格式PDF

  • 申请/专利权人 MTC:KK;

    申请/专利号JP20010353768

  • 发明设计人 IMAI ATSUO;

    申请日2001-11-19

  • 分类号B24C1/00;B24C5/02;G03F1/14;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-22 00:17:22

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