SLURRY FOR CHEMICAL AND MECHANICAL POLISHING (CMP), METHOD OF PRODUCING SEMICONDUCTOR DEVICE, APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE AND METHOD OF HANDLING CMP SLURRY

摘要

PROBLEM TO BE SOLVED: To provide a CMP slurry that can achieve high accurate polishing at a high polishing rate and can be easily stored and readily scrapped, a method of handling the slurry, a method of producing semiconductor devices using the same and an apparatus for producing semiconductor devices by using the same.;SOLUTION: The CMP slurry 7 comprises the dispersion medium 25, the polishing particles 18 which are dispersed in the dispersion medium 25 and develop photocatalytic action, when light is radiated and a nonionic surfactant dissolved in the dispersion medium 25.;COPYRIGHT: (C)2003,JPO