MECHANISM, APPARATUS, AND METHOD FOR PEELING ADHESIVE TAPE, DEVICE AND METHOD FOR PICKING UP SEMICONDUCTOR CHIP, AND METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PPROBLEM TO BE SOLVED: To manufacture a high-quality semiconductor device by reducing the occurrence of failures, such as cracks, chipping of a semiconductor chip, and at the same time, to suppress deterioration of the manufacturing yield of the semiconductor device. PSOLUTION: A peeling mechanism which peels an adhesive tape 24 stuck to a single semiconductor wafer 1 fixes the wafer 1 through adsorption by means of a porous material 2 separated into at least two adsorption region 2-1 to 2-7 in the peeling direction of the tape 24. Since the semiconductor wafer 1 can be fixed effectively by adsorption according to the peeling position of the tape 24, cracks or chipping of the semiconductor chip which occurs at peeling of the tape 24 can be prevented. PCOPYRIGHT: (C)2003,JPO