EPOXY RESIN COMPOSITION FOR ONE-SIDE SEALING USE AND ONE- SIDE-SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for one-side sealing use causing no bleeding after molded, having good continuous moldability and retaining reflow resistance.;SOLUTION: This epoxy resin composition for one-side sealing use essentially comprises an epoxy resin, a curing agent, an inorganic filler and a releasant which consists of montanoic acid and montanoic acid ethylenebisamide and/or oleic acid amide; wherein the amount of the releasant is 0.1-1 mass% based on the whole composition and the montanoic acid accounts for 30-70 mass% of the whole releasant. Owing to the releasant, this resin composition affords the above advantages.;COPYRIGHT: (C)2003,JPO