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ELECTROPOLISHING LIQUID, METHOD FOR ELECTROPOLISHING COPPER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

机译:电解液体,电解铜的方法以及制造半导体装置的方法

摘要

PROBLEM TO BE SOLVED: To provide an electropolishing liquid for precisely and stablly electropolishing copper, a method for electropolishing copper with the use of the electropolishing liquid, and a method for manufacturing a semiconductor device.;SOLUTION: The electropolishing liquid for electropolishing copper includes a copper ion. The method for electropolishing copper is characterized by making the electropolishing liquid containing the copper ion exist between a material to be polished of an anode and a cathode, and electrolytically treating the material. The method for manufacturing the semiconductor device, which electropolishes metallic wires including copper, is characterized by making the electropolishing liquid containing the copper ion exist between the material to be polished of the anode and the cathode, and electrolytically treating the material.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种用于精确且稳定地对铜进行电抛光的电抛光液,一种使用该电抛光液进行电抛光的方法以及一种半导体器件的制造方法。铜离子。电解抛光铜的方法的特征在于,使包含铜离子的电解抛光液存在于阳极和阴极的待抛光材料之间,并对该材料进行电解处理。用于电抛光包括铜的金属线的半导体器件的制造方法的特征在于,使包含铜离子的电抛光液存在于阳极和阴极的待抛光材料之间,并对该材料进行电解处理。 C)2004,日本特许厅

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