Low Roughness Copper Foil Manufacturing Method And Electropolishing Device Thereof And Copper Foil Thereof

摘要

PURPOSE: A method for manufacturing low roughness copper foil and an electropolishing apparatus are provided to manufacture wiring boards on which fine pitch having size of tens of micrometer is printed and realize both side polishing for secondary batteries, and a copper foil manufactured by the method is provided. CONSTITUTION: The electropolishing apparatus comprises pickling tank(100), a plurality of electropolishing tanks(200) and water cleaning tank(300) sequentially arranged in a row; a plurality of first rollers(500) dipped into the respective tanks to guide the copper coil so that dipping and separation of copper coil(40) are sequentially reciprocated in the respective tanks; a plurality of second rollers(510) positioned at a relatively high position above the respective tanks to guide the copper foil with the second rollers being contacted with the first rollers; and cathode plates(210) fixed to the copper foil dipped into the respective electropolishing tanks in such a way that the cathode plates face one side of the copper foil having a relatively high surface roughness so that respectively reverse electric currents are impressed to the cathode plates along with the copper foil, wherein the electropolishing apparatus further comprises cathode plates(210) fixed to the copper foil in such a way that the cathode plates face the other side of the copper foil having a relatively low surface roughness on one tank selected from the respective electropolishing tanks, wherein a liquid supply nozzle is additionally installed at the respective electropolishing tanks to supply an electropolishing solution to each axial direction of the copper foil dipped into the electropolishing tanks, and wherein the cathode plates are formed in a split shape so that an electric current having uniformed density is impressed to the cathode plates.