Method of manufacturing low profile copper foil bearing high tensile stress, Copper foil manufactured using the method, and electric device manufactured using the copper foil

摘要

A method of manufacturing an electrolytic copper foil with physical properties of high strength and low roughness, in which it is not necessary to change or modify design of a foil manufacturing apparatus during manufacturing of the electrolytic copper foil, and inexpensive raw materials of waste electric wires are used as they are without additional facilities and process, the electrolytic copper foil manufactured by the method, and various electronic components fabricated using the electrolytic copper foil are provided. In a method of manufacturing a copper foil by applying electric current between the rotating drum and the anode, thereby continuously electrodepositing a copper foil on the surface of the drum in a foil manufacturing apparatus comprising a vessel to which an electrolyte containing copper ions is consistently supplied, a drum which is rotated in a condition that a portion of the drum is immersed into the electrolyte, and to which a negative electric potential is impressed, and an anode spaced from an immersed portion of the drum in a predetermined gap and installed within the electrolyte, a method of manufacturing an electrolytic copper foil is characterized in that the electrolyte comprises 0.1 to 100 ppm of gelatin, 0.05 to 50 ppm of hydroxyethyl cellulose, 0.05 to 20 ppm of bis(sodiumsulfopropyl)disulfide and 0.01 to 20 ppm of thiourea as additives.