ULTRASONIC FLIP JUNCTION DEVICE AND METHOD AND ELEMENT CONFIGURATION SUITABLE FOR ULTRASONIC FLIP JUNCTION

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic flip junction device which enables stable junction of chip to a substrate with lower ultrasonic power.;SOLUTION: This ultrasonic flip junction device comprises an ultrasonic power generator for generating ultrasonic power, and a propagation tool for propagating the generated ultrasonic power to a chip as the junction object. The propagation tool includes a basic material having a holding surface to attract and hold the chip, and a coating layer which is coated on the holding surface to improve friction coefficient of the holding surface. The coating layer is such a layer as of ink, bonding agent, polymer material or the like. In addition, it is also possible to provided a similar coating layer to the surface attracted and held of the chip substrate joined in separation from or in combination with the ultrasonic flip junction device.;COPYRIGHT: (C)2003,JPO