ULTRASONIC JUNCTION TOOL, ULTRASONIC JUNCTION DEVICE AND JUNCTION MATERIAL PATTERN FORMATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic junction tool enabling the solder pattern formation of a desired shape or size.SOLUTION: In an ultrasonic junction tool 150, convex-shaped bodies 157 are formed on both ends of a tip portion 159. When supply solder is supplied to a notch 156, fused solder contacts a wall face 157b on the convex-shaped body side and a junction thickness adjustment face 157c. By this, the flow of the solder fused at the tip portion 159 to a plate width direction Fw is prevented by both convex-shaped bodies 157, and the scattering of a liquid drop to the plate width direction Fw caused by ultrasonic vibration is suppressed. Thus, the occurrence of a leak current is avoided because the solder pattern formed by the ultrasonic junction tool does not form an unnecessary solder pattern outside the convex-shaped bodies 157.