SUBSTRATE LAPPING APPARATUS, SUBSTRATE LAPPING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To miniaturize a CMP apparatus to reduce the area occupied thereby so that no limitations are encountered with the location when it is installed in a factory shop and the like. SOLUTION: In the substrate lapping apparatus to lap the surface of the substrate 1 by rotating both the substrate 1 and the platen 2 together under the condition that the substrate 1 and the polishing cloth 4 adhered to the platen 2 are made to come closely into contact, the moving guide to place the platen 2 on the substrate 1 and move the platen 2 in the direction horizontal to the substrate 1 is provided. The platen 2 is thus made to move relatively to the substrate 1, and the size of the lapping apparatus can be approximately the same as that of the substrate 1.