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DOUBLE-ELECTRODE WAFER HOLDER OF PLASMA-ASSISTED WAFER PROCESSING APPARATUS
DOUBLE-ELECTRODE WAFER HOLDER OF PLASMA-ASSISTED WAFER PROCESSING APPARATUS
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机译:等离子体辅助晶片加工装置的双电极晶片夹持器
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摘要
PROBLEM TO BE SOLVED: To improve the radial profile of plasma density on the surface of a wafer.;SOLUTION: A double-electrode wafer holder comprise a central electrode 2 to which an rf current is supplied from an rf power supply 8, a thin dielectric ring member 3 disposed around a sidewall of the central electrode, an outside electrode 4 disposed around the thin dielectric ring member, a dielectric plate 5, in which the outside electrode obtains part of the rf current provided to the central electrode by a capacitive coupling mechanism through the thin dielectric ring member, and which covers the upper surface of the outside electrode, and dielectric members 6a, 6b which cover a side surface and the lower surface of the outside electrode, and the lower surface of the central electrode.;COPYRIGHT: (C)2003,JPO
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