首页> 外国专利> Biased, triple-well fully depleted SOI structure, and various methods of making and operating same

Biased, triple-well fully depleted SOI structure, and various methods of making and operating same

机译:偏置的三阱完全耗尽的SOI结构及其各种制造和操作方法

摘要

In one illustrative embodiment, the device comprises a transistor formed above a silicon-on-insulator substrate comprised of a bulk substrate, a buried insulation layer and an active layer, the bulk substrate being doped with a first type of dopant material and a first well formed in the bulk substrate, the first well being doped with a second type of dopant material that is of a type opposite the first type of dopant material. The device further comprises a second well formed in the bulk substrate within the first well, the second well being doped with a dopant material that is the same type as the first type of dopant material, the transistor being formed in the active layer above the second well, an electrical contact for the first well and an electrical contact for said second well. In one illustrative embodiment, a method of forming a transistor above a silicon-on-insulator substrate comprised of a bulk substrate, a buried oxide layer and an active layer, the bulk substrate being doped with a first type of dopant material is disclosed. The method comprises performing a first ion implant process using a dopant material that is of a type opposite the first type of dopant material to form a first well region within the bulk substrate, performing a second ion implant process using a dopant material that is the same type as the first type of dopant material to form a second well region in the bulk substrate within the first well, the transistor being formed in the active layer above the second well, forming a conductive contact to the first well and forming a conductive contact to the second well. The method further comprises a contact well formed in the bulk substrate within the first well, the contact well being comprised of a dopant material that is of the same type as the second type of dopant material, the contact well within the first well having a dopant concentration that is greater than a dopant concentration of the first well.
机译:在一个说明性实施例中,该器件包括形成在绝缘体上硅衬底上方的晶体管,该绝缘体上硅衬底包括块状衬底,掩埋绝缘层和有源层,该块状衬底掺杂有第一类型的掺杂剂材料和第一阱。在大块衬底中形成第一掺杂剂,第一阱掺杂有第二类型的掺杂剂材料,该第二类型的掺杂剂材料与第一类型的掺杂剂材料相反。该器件还包括在第一阱内的块状衬底中形成的第二阱,第二阱中掺杂有与第一类型掺杂剂类型相同类型的掺杂剂材料,晶体管形成在第二阱上方的有源层中。井,第一井的电触点和所述第二井的电触点。在一个说明性实施例中,公开了一种在包括块状衬底,掩埋氧化物层和有源层的绝缘体上硅衬底上方形成晶体管的方法,该块状衬底掺杂有第一类型的掺杂剂材料。该方法包括:使用与第一类型的掺杂剂材料相反的类型的掺杂剂材料执行第一离子注入工艺,以在块状衬底内形成第一阱区;使用相同的掺杂剂材料执行第二离子注入工艺。在第一阱内的块状衬底中形成第二阱区以在第一阱内的有源层中形成晶体管,在第二阱上方的有源层中形成与第一阱的导电接触并与第一阱形成导电接触。第二口井。该方法还包括在第一阱内的块状衬底中形成的接触阱,该接触阱由与第二类型掺杂剂材料相同类型的掺杂剂材料组成,第一阱中的接触阱具有掺杂剂。浓度大于第一阱的掺杂剂浓度。

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