首页> 外国专利> Biased, triple-well fully depleted SOI structure, and various methods of making and operating same

Biased, triple-well fully depleted SOI structure, and various methods of making and operating same

机译:偏置的三阱完全耗尽的SOI结构及其各种制造和操作方法

摘要

In one example, a method of forming a transistor above a silicon-on-insulator substrate comprised of a bulk substrate, a buried oxide layer and an active layer, the bulk substrate being doped with a first type of dopant material is disclosed. The method comprises performing a first ion implant process using a dopant material that is of a type opposite the first type of dopant material to form a first well region within the bulk substrate, performing a second ion implant process using a dopant material that is the same type as the first type of dopant material to form a second well region in the bulk substrate within the first well, the transistor being formed in the active layer above the second well, forming a conductive contact to the first well and forming a conductive contact to the second well.
机译:在一个示例中,公开了一种在由块状衬底,掩埋氧化物层和有源层组成的绝缘体上硅衬底上方形成晶体管的方法,该块状衬底掺杂有第一类型的掺杂剂材料。该方法包括:使用与第一类型的掺杂剂材料相反的类型的掺杂剂材料执行第一离子注入工艺,以在块状衬底内形成第一阱区域;使用相同的掺杂剂材料执行第二离子注入工艺。在第一阱内的块状衬底中形成第二阱区以在第一阱内的有源层中形成晶体管,在第二阱上方的有源层中形成与第一阱的导电接触并与第一阱形成导电接触。第二口井。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号