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Printed wiring board having connecting terminals for electrically connecting conductor layers, circuit module having printed wiring board, and manufacturing method for printed wiring board

机译:具有用于电连接导体层的连接端子的印刷线路板,具有该印刷线路板的电路模块以及该印刷线路板的制造方法

摘要

A printed wiring board comprises a substrate having a plurality of conductor layers and an insulating layer interposed between the conductor layers and a connecting terminal electrically connecting the conductor layers. The connecting terminal includes a shaft portion penetrating the insulating layer and having a distal end in contact with one of the conductor layers, and a head portion situated on the side opposite from the distal end of the shaft portion and in contact with another one of the conductor layers.
机译:印刷线路板包括:基板,其具有多个导体层;和绝缘层,所述绝缘层置于所述导体层之间;以及电连接所述导体层的连接端子。所述连接端子包括:轴部,其穿过所述绝缘层,并且具有与所述导体层之一接触的远端;以及头部,其位于与所述轴部的远端相反的一侧并且与所述导体层中的另一个接触。导体层。

著录项

  • 公开/公告号US2003099099A1

    专利类型

  • 公开/公告日2003-05-29

    原文格式PDF

  • 申请/专利权人 AOKI KENJI;

    申请/专利号US20020234388

  • 发明设计人 KENJI AOKI;

    申请日2002-09-05

  • 分类号H05K1/11;H05K1/14;

  • 国家 US

  • 入库时间 2022-08-22 00:10:18

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