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Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same

机译:利用形成用于形成绝缘体上的材料的顺应性衬底的绝缘体(SOI)结构和器件的结构和方法的制造方法

摘要

High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. A monocrystalline layer is then formed over the accommodating buffer layer, such that a lattice constant of the monocrystalline layer substantially matches the lattice constant of a subsequently grown monocrystalline film.
机译:通过形成用于生长单晶层的顺应性衬底,可以在诸如大硅晶片的单晶衬底上生长高质量的单晶材料外延层。容纳缓冲层包括由非晶硅氧化物界面层与硅晶片间隔开的单晶氧化物层。非晶界面层消除了应变,并允许生长高质量的单晶氧化物容纳缓冲层。容纳缓冲层与下面的硅晶片和上面的单晶材料层晶格匹配。然后在容纳缓冲层上方形成单晶层,使得单晶层的晶格常数基本上匹配随后生长的单晶膜的晶格常数。

著录项

  • 公开/公告号US2003015702A1

    专利类型

  • 公开/公告日2003-01-23

    原文格式PDF

  • 申请/专利权人 MOTOROLA INC.;

    申请/专利号US20010908707

  • 申请日2001-07-20

  • 分类号H01L21/00;H01L21/30;

  • 国家 US

  • 入库时间 2022-08-22 00:09:21

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