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Structure and method for fabricating heterojunction bipolar transistors and high electron mobility transistors utilizing the formation of a complaint substrates for materials used to form the same

机译:利用形成用于形成异质结双极晶体管的材料的抱怨衬底的结构和方法来制造异质结双极晶体管和高电子迁移率晶体管

摘要

High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Once such a structure is built, a high electron mobility transistor (HEMT) or a heterojunction bipolar transistor (HBT) can be constructed on the structure. A HEMT or HBT of the above structure can then be used in a switch or in an amplifier.
机译:通过形成用于生长单晶层的顺应性衬底,可以在诸如大硅晶片的单晶衬底上生长高质量的单晶材料外延层。容纳缓冲层包括由非晶硅氧化物界面层与硅晶片间隔开的单晶氧化物层。非晶态界面层消除了应变,并允许生长高质量的单晶氧化物容纳缓冲层。容纳缓冲层与下面的硅晶片和上面的单晶材料层晶格匹配。非晶态界面层可以解决容纳缓冲层和下面的硅衬底之间的任何晶格失配问题。一旦构建了这样的结构,就可以在该结构上构建高电子迁移率晶体管(HEMT)或异质结双极晶体管(HBT)。然后,可以将上述结构的HEMT或HBT用于开关或放大器中。

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