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Semiconductor analysis apparatus, semiconductor analysis method and method for manufacturing semiconductor device

机译:半导体分析装置,半导体分析方法及半导体装置的制造方法

摘要

In a semiconductor analysis method in accordance with the present invention, a semiconductor integrated circuit defining an object to be measured is put in an operating state, a laser beam is irradiated on the object to be measured, scattered light of the irradiated laser beam scattered on the object to be measured is spectroscopically separated by a Raman spectroscopy apparatus, amounts of shifts in Raman spectra appearing due to the Raman effect are calculated, temperature of minute areas of the object to be measured is calculated based on the relation between the temperature obtained in advance and the amounts of frequency shifts, and the defective location that is generating heat is detected based on the temperature.
机译:在根据本发明的半导体分析方法中,将限定被测量物体的半导体集成电路置于工作状态,将激光束照射在被测量物体上,将所照射的激光束的散射光散射在被测物体上。用拉曼光谱仪将待测物体光谱分离,计算由于拉曼效应而出现的拉曼光谱位移量,并根据在室温下获得的温度之间的关系计算出待测物体的微小区域的温度。提前和频率偏移量,并根据温度检测产生热量的缺陷位置。

著录项

  • 公开/公告号US2003002035A1

    专利类型

  • 公开/公告日2003-01-02

    原文格式PDF

  • 申请/专利权人 NODA TAKAFUMI;

    申请/专利号US20020147342

  • 发明设计人 TAKAFUMI NODA;

    申请日2002-05-16

  • 分类号G01N21/65;G01N21/88;

  • 国家 US

  • 入库时间 2022-08-22 00:08:28

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