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Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
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机译:表面处理的铜箔,带载体的电沉积铜箔,带载体的电沉积铜箔的制造方法以及覆铜箔层压板
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摘要
The purpose is to provide a surface treated copper foil and an electrodeposited copper foil with carrier to be employed for a copper clad laminate capable to be processed for simultaneous hole formation in the copper foil layer and a substrate resin layer using carbon dioxide gas laser. The purpose can be achieved by using a surface treated copper foil bearing a nickel layer or a cobalt layer with a prescribed thickness in one side of a copper foil or an electrodeposited copper foil with carrier provided with a nickel layer or a cobalt layer with a prescribed thickness between a carrier foil and an electrode posited copper foil layer. When a copper clad laminate is manufactured using these foils, the copper clad laminate is capable to be processed to easily and simultaneously form a hole in the copper foil layer and the substrate resin layer using carbon dioxide gas laser.
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