SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE, SEMICONDUCTOR APPARATUS PROVIDED WITH A PLURALITY OF SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGES, METHOD OF INSPECTING SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

The present invention provides a resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package comprises a semiconductor IC chip, a plurality of leads arranged on the semiconductor IC chip and having end portions bent so as to extend perpendicularly to the major surface of the semiconductor IC chip, a resin molding sealing the semiconductor IC chip and the leads therein so that the tips of the end portions of the leads are exposed on one surface thereof, and conductive elements connected respectively to the exposed tips of the leads.