首页> 外国专利> Rough (high surface area) electrode from Ti and TiN, capacitors and semiconductor devices including same

Rough (high surface area) electrode from Ti and TiN, capacitors and semiconductor devices including same

机译:Ti和TiN制成的粗糙(高表面积)电极,电容器和包括该电极的半导体器件

摘要

A technique for forming a high surface area electrode or storage node for a capacitor and devices formed thereby, including depositing a first layer of conductive material on a substrate, such that a discontinuous layer is formed. A second conductive material layer is deposited over the discontinuous first conductive material layer, such that the second conductive material layer grows or accumulates on the discontinuous first conductive material layer at a faster rate than on the exposed areas of the substrate in the discontinuous first conductive material layer to form a rough conductive material layer.
机译:一种用于形成用于电容器的高表面积电极或存储节点以及由此形成的器件的技术,该技术包括在基板上沉积第一导电材料层,从而形成不连续层。在不连续的第一导电材料层上沉积第二导电材料层,使得第二导电材料层以比在不连续的第一导电材料中的基板的暴露区域上更快的速率生长或累积在不连续的第一导电材料层上。形成粗糙的导电材料层。

著录项

  • 公开/公告号US6608343B2

    专利类型

  • 公开/公告日2003-08-19

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US20010005850

  • 发明设计人 GURTEJ S. SANDHU;GARO J. DERDERIAN;

    申请日2001-12-05

  • 分类号H01L271/08;

  • 国家 US

  • 入库时间 2022-08-22 00:06:56

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