首页> 外国专利> SOI SUBSTRATE, ELEMENT SUBSTRATE, SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL APPARATUS, ELECTRONIC EQUIPMENT, METHOD OF MANUFACTURING THE SOI SUBSTRATE, METHOD OF MANUFACTURING THE ELEMENT SUBSTRATE, AND METHOD OF MANUFACTURING THE ELECTRO-OPTICAL APPARATUS

SOI SUBSTRATE, ELEMENT SUBSTRATE, SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL APPARATUS, ELECTRONIC EQUIPMENT, METHOD OF MANUFACTURING THE SOI SUBSTRATE, METHOD OF MANUFACTURING THE ELEMENT SUBSTRATE, AND METHOD OF MANUFACTURING THE ELECTRO-OPTICAL APPARATUS

机译:SOI基质,元素基质,半导体器件,光电设备,电子设备,制造SOI基质的方法,制造元素基质的方法以及制造光电器件的方法

摘要

An SOI (Silicon On Insulator) substrate is provided with: a support substrate (201); a single crystal silicon layer (202) disposed above one surface of the support substrate; an insulation portion (205) disposed between the support substrate and the single crystal silicon layer, the insulation portion comprising a single layer of an insulation film or a lamination structure of a plurality of insulation films, and including a silicon nitride film or a silicon nitride oxide film (204).
机译:SOI(绝缘体上硅)基板具有:支撑基板( 201 );和在支撑衬底的一个表面上方设置的单晶硅层( 202 );绝缘部分( 205 ),其设置在支撑基板和单晶硅层之间,该绝缘部分包括单层绝缘膜或多个绝缘膜的层压结构,并且包括氮化硅膜或氮氧化硅膜( 204 )。

著录项

  • 公开/公告号US6583440B2

    专利类型

  • 公开/公告日2003-06-24

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US20010988332

  • 发明设计人 MASAHIRO YASUKAWA;

    申请日2001-11-19

  • 分类号H01L290/40;

  • 国家 US

  • 入库时间 2022-08-22 00:06:18

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