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Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals

机译:改进金属化学沉积中界面化学反应的方法和装置

摘要

A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and especially before immersion in the electroless plating solution. The pre-heating is carried out to a temperature that is needed to bring about the desired chemical reaction at the substrate-solution interface, allowing the bath of that process step to operate significantly below the temperature that would have been needed if the panel had not been pre-heated, and below the solution temperature of current practice. According to another aspect of the present invention, the electroless plating apparatus for plating a workpiece operates in a vertical mode and it comprises a heating station, with the panel to be plated returning to the heating station as dictated by the temperature required for a given process step. Alternatively, the heating station is incorporated into the hoist system of such apparatus. In still another aspect of the present invention, the electroless plating apparatus operates in a horizontal mode and comprises at least one heating station.
机译:一种用于改善金属的化学沉积中的界面化学反应的方法和设备,其中在将待镀的基板浸入需要高温的各种处理溶液之前,特别是在浸入化学镀溶液之前,将要镀的基板预热。将预热进行到在底物-溶液界面处引起所需化学反应所需的温度,从而使该工艺步骤的镀液能够在低于如果不使用面板的情况下所需的温度下显着运行。预先加热,并低于目前的溶液温度。根据本发明的另一方面,用于镀覆工件的化学镀装置以垂直模式操作,并且其包括加热站,根据给定过程所需的温度,待镀的面板返回到加热站。步。可替代地,加热站被结合到这种设备的提升系统中。在本发明的又一方面,化学镀装置以水平模式操作并且包括至少一个加热站。

著录项

  • 公开/公告号US6599563B2

    专利类型

  • 公开/公告日2003-07-29

    原文格式PDF

  • 申请/专利权人 J.G. SYSTEMS INC.;

    申请/专利号US20020230269

  • 发明设计人 JOHN GRUNWALD;

    申请日2002-08-29

  • 分类号B05D11/80;B05D31/00;B05D30/20;B05D51/20;

  • 国家 US

  • 入库时间 2022-08-22 00:05:37

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