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Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics Interconnects

机译：高温电子互连Au-GE焊料和无电镀Ni-W-P金属化的界面反应和微观结构演化

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Li Liu; Jinzi Cui; Jing Wang; Zhaoxia Zhou; R. Wayne Johnson; Changqing Liu;
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1. Significantly retarded interfacial reaction between an electroless Ni-W-P metallization and lead-free Sn-3.5Ag solder [J] . Ying Yang, J.N. Balaraju, Ser Choong Chong Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2013,第Null期

机译：Ni-W-P化学镀层和无铅Sn-3.5Ag焊料之间的界面反应明显受阻
2. Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects [J] . Liu Li, Chen Zhiwen, Zhou Zhaoxia, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2017,第期

机译：高温Zn-5Al / Cu焊料互联镀膜中电镀Ni-W-P涂层的扩散阻挡性能
3. Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With the Electroless Ni-P Metallization for BGA Solder Joints Application [J] . Alam M. O., Chan Y. C. IEEE Transactions on Components and Packaging Technologies . 2008,第2期

机译：Sn-3.5％Ag焊锡中0.5 wt％Cu对BGA焊点化学镀Ni-P镀层延缓界面反应的影响
4. Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics Interconnects [C] . Li Liu, Jinzi Cui, Jing Wang, IEEE Electronic Components and Technology Conference . 2017

机译：高温电子互连中Au-Ge焊料与化学镀Ni-W-P金属之间的界面反应和微观结构演变
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs [O] . Na Wu, Yongfang Hu, Shufeng Sun 2020

机译：GaAs MMIC的Au-Sn焊料与不同背面金属化系统之间的微观结构表征和界面反应
7. Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects [O] . Liu, Li, Chen, Zhiwen, Zhou, Zhaoxia, 2017

机译：高温Zn-5Al / Cu焊料互连中化学镀Ni-W-P涂层的扩散阻挡性能

Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallization in High Temperature Electronics Interconnects

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