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Thin-film device with improved cohesion and electrical conductance between electrically conductive thin-film and electrical conductor in contact therewith, and manufacturing method therefor
Thin-film device with improved cohesion and electrical conductance between electrically conductive thin-film and electrical conductor in contact therewith, and manufacturing method therefor
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机译:具有改进的导电薄膜和与其接触的电导体之间的内聚性和导电性的薄膜装置及其制造方法
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摘要
A coil layer as an electrically conductive thin-film of a thin-film device comprises a copper layer as an electrically conductive material layer and a nickel layer as an electrically conductive protective layer composed of a material, in which an oxide layer formed on the material grows to a thickness of not more than a predetermined thickness. Consequently, the thickness of the oxide layer can be predicted and the oxide layer can be reliably removed by ion-milling or the like.
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