首页> 外国专利> Thin-film device with improved cohesion and electrical conductance between electrically conductive thin-film and electrical conductor in contact therewith, and manufacturing method therefor

Thin-film device with improved cohesion and electrical conductance between electrically conductive thin-film and electrical conductor in contact therewith, and manufacturing method therefor

机译:具有改进的导电薄膜和与其接触的电导体之间的内聚性和导电性的薄膜装置及其制造方法

摘要

A coil layer as an electrically conductive thin-film of a thin-film device comprises a copper layer as an electrically conductive material layer and a nickel layer as an electrically conductive protective layer composed of a material, in which an oxide layer formed on the material grows to a thickness of not more than a predetermined thickness. Consequently, the thickness of the oxide layer can be predicted and the oxide layer can be reliably removed by ion-milling or the like.
机译:作为薄膜器件的导电薄膜的线圈层包括:铜层,作为导电材料层;以及镍层,作为由材料构成的导电保护层,其中,在该材料上形成有氧化层。生长到不大于预定厚度的厚度。因此,可以预测氧化物层的厚度,并且可以通过离子研磨等可靠地去除氧化物层。

著录项

  • 公开/公告号US6490128B1

    专利类型

  • 公开/公告日2002-12-03

    原文格式PDF

  • 申请/专利权人 ALPS ELECTRIC CO. LTD.;

    申请/专利号US20000569260

  • 发明设计人 KIYOSHI SATO;

    申请日2000-05-11

  • 分类号G11B53/10;G11B51/70;

  • 国家 US

  • 入库时间 2022-08-22 00:04:49

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