首页> 外国专利> Method of forming pre-metal dielectric film on a semiconductor substrate including first layer of undoped oxide of high ozone:TEOS volume ratio and second layer of low ozone doped BPSG

Method of forming pre-metal dielectric film on a semiconductor substrate including first layer of undoped oxide of high ozone:TEOS volume ratio and second layer of low ozone doped BPSG

机译:在半导体衬底上形成金属前介电膜的方法,该半导体衬底包括第一层高臭氧:TEOS体积比的未掺杂氧化物和第二层低臭氧掺杂的BPSG

摘要

A method of forming a pre-metal dielectric film having good as deposited gapfill characteristics, as well as good mobile-ion gettering capability. The method involves first depositing a layer of high-ozone undoped silicon dioxide film having a high ozone/TEOS volume ratio. Then, a low-ozone doped BPSG film is deposited over the high-ozone undoped silicon dioxide layer. The film layers are heat treated to densify the film, and then the top layer is planarized using known planarization techniques to a thickness that allows for adequate mobile-ion gettering.
机译:一种形成具有良好的沉积间隙填充特性以及良好的移动离子吸杂能力的金属前电介质膜的方法。该方法包括首先沉积具有高臭氧/ TEOS体积比的高臭氧未掺杂二氧化硅膜层。然后,将低臭氧掺杂的BPSG膜沉积在未掺杂高臭氧的二氧化硅层上。对膜层进行热处理以使膜致密,然后使用已知的平面化技术将顶层平面化至允许足够的移动离子吸杂的厚度。

著录项

  • 公开/公告号NO20030902L

    专利类型

  • 公开/公告日2003-02-26

    原文格式PDF

  • 申请/专利权人 ATMEL CORP;

    申请/专利号NO20030000902

  • 发明设计人 KELKAR AMIT S;WHITEMAN MICHAEL D;

    申请日2003-02-26

  • 分类号7H01LA;

  • 国家 NO

  • 入库时间 2022-08-22 00:01:57

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