BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES AND COLLETS FOR BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES

摘要

Bonding of flip-chip mounted light emitting devices having an irregularconfiguration is provided. Light emitting diodes having a shaped substrate arebonded to a submount by applying forces to the substrate an a manner such thatshear forces within the substrate do not exceed a failure threshold of thesubstrate. Bonding a light emitting diode to a submount may be provided byapplying force to a surface of a substrate of the light emitting diode that isoblique to a direction of motion of the light emitting diode tothermosonically bond the light emitting diode to the submount. Collets for usein bonding shaped substrates to a submount and systems for bonding shapedsubstrates to a submount are also provided.