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Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
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机译:具有成型衬底的发光二极管的结合和用于具有成型衬底的发光二极管的筒夹的结合
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摘要
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.
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