BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES AND COLLETS FOR BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES

摘要

The flip bonded of luminescent device has irregular construction. Light emitting diode with shaped substrates is integrated to time by exerting a force to the substrate, is no more than the substrate of failure threshold with the shearing force in substrate in such a way. The light emitting diode for applying force to that the direction of motion is favoured to the surface of the substrate of light emitting diode can be provided in conjunction with light emitting diode to base station, light emitting diode and heat are ultrasonically bonded to base station. Collet is for binding forming substrate base station and system for shaped substrates base station to be also provided.